메뉴 건너뛰기




Volumn , Issue , 2009, Pages 345-348

Including stripline connections into network parameter based via models for fast simulation of interconnects

Author keywords

[No Author keywords available]

Indexed keywords

ADMITTANCE MATRICES; ANALYTICAL FORMULATIONS; COMPUTATION SPEED; COUPLING FACTORS; FAST SIMULATIONS; FULL-WAVE SIMULATIONS; GOOD CORRELATIONS; MODAL DECOMPOSITIONS; NETWORK PARAMETERS; PACKAGE STRUCTURES; PARALLEL CONNECTIONS; PARALLEL PLATES; PARAMETERIZED; PHYSICS-BASED; POWER PLANES; STRIP LINES; THREE ORDERS OF MAGNITUDES;

EID: 64249108550     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMCZUR.2009.4783461     Document Type: Conference Paper
Times cited : (19)

References (18)
  • 5
    • 0033360282 scopus 로고    scopus 로고
    • Modelling of interconnections and isolation within a multilayered ball grid array package
    • Sep
    • R. Ito, R. W. Jackson, T. Hongsmatip, "Modelling of interconnections and isolation within a multilayered ball grid array package," IEEE Transactions on Microwave Theory and Techniques, vol. 47, no. 9, pp. 1819-1825, Sep. 1999.
    • (1999) IEEE Transactions on Microwave Theory and Techniques , vol.47 , Issue.9 , pp. 1819-1825
    • Ito, R.1    Jackson, R.W.2    Hongsmatip, T.3
  • 11
    • 0035813539 scopus 로고    scopus 로고
    • Modeling of multiple scattering among vias in planar waveguides using foldy-lax equations
    • Nov
    • L. Tsang, H. Chen, C. C. Huang, V. Jandhyala, "Modeling of multiple scattering among vias in planar waveguides using foldy-lax equations," Microwave Optical Technologies Letters, vol. 31, pp. 201-208, Nov. 2001.
    • (2001) Microwave Optical Technologies Letters , vol.31 , pp. 201-208
    • Tsang, L.1    Chen, H.2    Huang, C.C.3    Jandhyala, V.4
  • 12
    • 51649126662 scopus 로고    scopus 로고
    • Y. Zhang, J. Fan, G. Selli, M. Cocchini, F. De Paulis, Analytical Evaluation of Via-Plate Capacitance for Multilayer Printed Circuit Boards and Packages, submitted to IEEE Transactions on Microwave Theory and Techniques, 2008.
    • Y. Zhang, J. Fan, G. Selli, M. Cocchini, F. De Paulis, "Analytical Evaluation of Via-Plate Capacitance for Multilayer Printed Circuit Boards and Packages," submitted to IEEE Transactions on Microwave Theory and Techniques, 2008.
  • 13
    • 0003877684 scopus 로고
    • New York, USA: John Wiley & Sons, pp, / 187-245, ISBN 0-471-02080-X
    • C. R. Paul, Analysis of Multiconductor Transmission Lines, New York, USA: John Wiley & Sons, pp. 47-76/ 187-245, 1994. ISBN 0-471-02080-X.
    • (1994) Analysis of Multiconductor Transmission Lines , pp. 47-76
    • Paul, C.R.1
  • 17
    • 0003774633 scopus 로고
    • K. C. Gupta, M. D. Abouzahra, Ed, USA: IEEE Press, ISBN 978-0780304376
    • K. C. Gupta, M. D. Abouzahra, Ed., Analysis and Design of Planar Microwave Components, USA: IEEE Press (1994), pp. 75-86, ISBN 978-0780304376.
    • (1994) Analysis and Design of Planar Microwave Components , pp. 75-86
  • 18
    • 64249134280 scopus 로고    scopus 로고
    • TM, Ver. 11, Ansoft Corporation, Pittsburgh, USA, 2008.
    • TM, Ver. 11, Ansoft Corporation, Pittsburgh, USA, 2008.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.