Modeling and transient simulation of planes in electronic packages

IEEE Transactions on Advanced Packaging

Volumn 23, Issue 3, 2000, Pages 340-352

  Na, Nanju ^b   Choi, Jinseong ^b   Chun, Sungjun ^b   Swaminathan, Madhavan ^a,b   Srinivasan, Jegannathan ^b  

^a IEEE   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Decoupling capacitor; Multiple layer modeling; Plane modeling; Power distribution network; Resonator model

Indexed keywords

ALGORITHMS; CAPACITORS; COMPUTER SIMULATION; EQUIVALENT CIRCUITS; MATRIX ALGEBRA; MAXWELL EQUATIONS; PRINTED CIRCUIT BOARDS; SCATTERING PARAMETERS; SKIN EFFECT;

DECOUPLING CAPACITORS; MULTIPLE LAYER MODELING; PLANE MODELING; POWER DISTRIBUTION NETWORKS; RESONATOR MODEL;

ELECTRONICS PACKAGING;

EID: 0034239323     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.861546     Document Type: Article

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