Wafer-scale nanopatterning using electrodeposition

Journal of Vacuum Science and Technology B:Nanotechnology and Microelectronics

Volumn 28, Issue 4, 2010, Pages 849-853

  Lee, Leung Kway ^a   Kua, Pei Cheng ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRODEPOSITION; NANOSTRUCTURED MATERIALS;

ELECTRODEPOSITION PROCESS; ETCH MASK; I-LINE LITHOGRAPHY; LINE EDGE ROUGHNESS; METAL DEPOSITION; METAL LAYER; MICROSCALE FEATURES; NANO SCALE; NANO-SCALE PATTERNS; NANOPATTERNING; NANOSCALE DEVICE; PATTERN DENSITY; PATTERN TRANSFERS; PROOF OF CONCEPT; REGISTRATION ERROR; RESOLUTION LIMITS; SEMICONDUCTING SURFACES; SHRINKING RATES; SUB-100 NM; WAFER-SCALE;

REACTIVE ION ETCHING;

EID: 77957232621     PISSN: 21662746     EISSN: 21662754     Source Type: Journal    
DOI: 10.1116/1.3466883     Document Type: Conference Paper

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