Modeling thermal reflow of resist contact hole arrays

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5256, Issue 2, 2003, Pages 1045-1056

  Lee, Jae Won ^a   Feng, Zhaohua ^a   Engelstad, Roxann L ^a   Lovell, Edward G ^a  

^a University of Wisconsin Madison   (United States)

Author keywords

Contact hole array; Finite element analysis; Resist reflow; Thermomechanical response

Indexed keywords

ARRAYS; COMPUTER SIMULATION; FINITE ELEMENT METHOD; GLASS TRANSITION; IMAGING TECHNIQUES; INTEGRATED CIRCUITS; MATHEMATICAL MODELS; PRINTING; PROJECTION SYSTEMS; SILICON; STRESS ANALYSIS; THERMOMECHANICAL TREATMENT; VISCOELASTICITY;

CONTACT-HOLE ARRAYS; RESIST REFLOW;

PHOTORESISTS;

EID: 1842526977     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.517886     Document Type: Conference Paper

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