Modelling the effect of complex waveform on surface finishing in pulse current electroforming of nickel

Surface and Coatings Technology

Volumn 135, Issue 1, 2000, Pages 91-97

  Wong, K P ^a   Chan, K C ^a   Yue, T M ^a  

^a HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROFORMING; ELECTROPLATING; HYDROGEN; MORPHOLOGY; NICKEL; RELAXATION PROCESSES; SCANNING ELECTRON MICROSCOPY; SURFACE ROUGHNESS; WAVEFORM ANALYSIS;

PULSE CURRENT ELECTROFORMING;

PROTECTIVE COATINGS;

EID: 0034512132     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0257-8972(00)00983-X     Document Type: Article

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