Amorphous RuW film as a diffusion barrier for advanced Cu metallization

Journal of the Electrochemical Society

Volumn 157, Issue 8, 2010, Pages

  Yeh, Jia Bin ^a   Perng, Dung Ching ^a   Hsu, Kuo Chung ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

AMORPHOUS-LIKE; BARRIER PROPERTIES; COPPER DIFFUSION BARRIER; COPPER METALLIZATION; CU DIFFUSION; CU METALLIZATION; ORDERS OF MAGNITUDE; RU FILM; SHEET RESISTANCE MEASUREMENTS; STACKED STRUCTURE; THERMAL STABILITY; THERMALLY STABLE; XRD STUDIES;

AMORPHOUS FILMS; DIFFUSION BARRIERS; ELECTRIC RESISTANCE; ELECTRIC RESISTANCE MEASUREMENT; FILM GROWTH; HOLOGRAPHIC INTERFEROMETRY; METALLIZING; THERMODYNAMIC STABILITY; X RAY DIFFRACTION; X RAY DIFFRACTION ANALYSIS;

COPPER;

EID: 77954737340     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3447739     Document Type: Article

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