Effect of a thin lonized-metal-plasma deposited Cu layer on the properties and thermal stability of Cu-TaN-SiO2-Si structures

IEEE Transactions on Device and Materials Reliability

Volumn 1, Issue 4, 2001, Pages 174-178

  Zhang, D H ^a   Loh, S W ^a   Li, C Y ^b   Liu, Rong ^c   Wee, Andrew T S ^c  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

^c NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0037659972     PISSN: 15304388     EISSN: 15304388     Source Type: Journal    
DOI: 10.1109/7298.995830     Document Type: Article

References (11)

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