Investigation of copper agglomeration at elevated temperatures

Journal of the Electrochemical Society

Volumn 150, Issue 12, 2003, Pages

  Yang, Ching Yu ^a   Chen, J S ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

AGGLOMERATION; ANNEALING; AUGER ELECTRON SPECTROSCOPY; HIGH TEMPERATURE EFFECTS; MAGNETRON SPUTTERING; MORPHOLOGY; SCANNING ELECTRON MICROSCOPY; SILICA; SILICON WAFERS; SUBSTRATES; X RAY DIFFRACTION ANALYSIS; X RAY PHOTOELECTRON SPECTROSCOPY;

CHEMICAL BINDING STATE; COPPER THIN FILM; ELEMENTAL DEPTH PROFILE; HIGH TEMPERATURE ANNEALING; SHEET RESISTANCE;

COPPER;

EID: 0346390632     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1627350     Document Type: Article

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