Effects of Ru-Ta alloy barrier on Cu filling and reliability for Cu interconnects

2008 IEEE International Interconnect Technology Conference, IITC

Volumn , Issue , 2008, Pages 99-101

  Mori, Kenichi ^a   Ohmori, Kazuyuki ^a   Torazawa, Naoki ^b   Hirao, Shuji ^b   Kaneyama, Syutetsu ^b   Korogi, Hayato ^b   Maekawa, Kazuyoshi ^a   Fukui, Shoichi ^a   Tomita, Kazuo ^a   Inoue, Makoto ^a   Chibahara, Hiroyuki ^a   Imai, Yukari ^a   Suzumura, Naohito ^a   Asai, Koyu ^a   Kojima, Masayuki ^a  

^a RENESAS TECHNOLOGY CORP   (Japan)

^b PANASONIC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALLOYS; COMPUTER NETWORKS; OPTICAL INTERCONNECTS; RUTHENIUM ALLOYS; TANTALUM; TANTALUM ALLOYS;

ALLOY FILMS; CMP PROCESSES; ESTIMATED LIFETIME; INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE;

COPPER;

EID: 50949097601     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2008.4546937     Document Type: Conference Paper

References (5)

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2. A. Sakata, et al., Proc. of IITC 2006, pp.101-103
3. C-C. Yang, et al., Proc. of IITC 2006, pp.187-189
4. M. Abe, et al., Proc. of IITC 2007, pp.4-6
5. K. Mori, et al., Proc. of AMC 2006, p.467