Plasma enhanced atomic layer deposition of Ru-Ta composite film as a seed layer for CVD Cu filling

2008 IEEE International Interconnect Technology Conference, IITC

Volumn , Issue , 2008, Pages 156-158

  Jeong, Daekyun ^a   Inoue, Hiroaki ^a   Shinriki, Hiroshi ^a  

^a ASM Japan   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

AGRICULTURAL PRODUCTS; ATOMIC LAYER DEPOSITION; ATOMIC PHYSICS; ATOMS; CHEMICAL VAPOR DEPOSITION; COMPOSITE FILMS; COMPUTER NETWORKS; PLASMA DEPOSITION; PLASMAS; PULSED LASER DEPOSITION; SEED; TANTALUM;

SEED LAYERS; TA COMPOSITE;

COPPER;

EID: 50949117666     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2008.4546954     Document Type: Conference Paper

References (5)

1. The International Technology Roadmap for Semiconductors: http://www.itrs.net/
2. V. Arnal, A. Farcy, M.Aimadeddine, V. Jousseaume, L.G. Gosset, J. Guillan, M. Assous, L. Favennec, A. Zenasni, T. David, K.Hamioud, L-L. Chapelon, N. Jourdan, T. Vanypre, T. Mourier, P. Chausse, S. Maitrejean, C. Guedj, J. Torres, "Materials and processes for high signal propagation performance and reliable 32 nm node BEOL", pp.1-3, International Interconnect Technology Conference, IEEE (2007)
3. S. Rossnagel, "The latest in Ru-Cu interconnect technology", Solid State Technology Online Article, Feb. Exclusive Feature #1: DEPOSITION (2005)
4. D. Jeong, S. Ozawa, H. Inoue, A. Tashiro, A. Shimizu, H. Shinriki, "Atomic layer deposition of Ru/TaNC bi-layer for ultrathin CVD Cu seed formation", Proceedings of Adv. Metal. Confer. (2007)
5. N. Ohashi, "Highly Reliabile ALD-TaN technology for Cu/porous low-k integration", The AVS Topical Conference on Atomic Layer Deposition (2005)