Electrodeposition of copper thin on ruthenium. A potential diffusion barrier for Cu interconnects

Journal of the Electrochemical Society

Volumn 150, Issue 5, 2003, Pages

  Chyan, Oliver ^a   Arunagiri, Tiruchirapalli N ^a   Ponnuswamy, Thomas ^a  

^a UNIVERSITY OF NORTH TEXAS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ANNEALING; COATING TECHNIQUES; DIFFUSION; ELECTRIC CURRENTS; ELECTRODEPOSITION; NUCLEATION; RUTHENIUM; SCANNING ELECTRON MICROSCOPY; THICKNESS CONTROL; THIN FILMS; X RAY DIFFRACTION ANALYSIS;

COPPER INTERCONENECTS; METALLURGICAL INTERACTION; POTENTIAL DIFFUSION BARRIER; POTENTIOSTATIC CURRETN TRANSIENT METHOD; SULFURIC ACID PLATING BATH;

COPPER;

EID: 0038516975     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1565138     Document Type: Article

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