Process performance prediction for chemical mechanical planarization (CMP) by integration of nonlinear bayesian analysis and statistical modeling

IEEE Transactions on Semiconductor Manufacturing

Volumn 23, Issue 2, 2010, Pages 316-327

  Kong, Zhenyu ^a   Oztekin, Asil ^a   Beyca, Omer Faruk ^a   Phatak, Upendra ^a,b   Bukkapatnam, Satish T S ^a   Komanduri, Ranga ^a  

^a OKLAHOMA STATE UNIVERSITY   (United States)

^b Arkansas Power Electronics International Inc   (United States)

Author keywords

Bayesian analysis; Chemical mechanical planarization (CMP); Design of experiments; Particle filtering; Process performance prediction; Vibration sensors

Indexed keywords

BAYESIAN ANALYSIS; CHEMICAL MECHANICAL PLANARIZATION (CMP); CHEMICAL-MECHANICAL PLANARIZATION; PARTICLE FILTERING PROCESS; VIBRATION SENSORS;

BAYESIAN NETWORKS; CHEMICAL ANALYSIS; CHEMICAL MECHANICAL POLISHING; CHEMICAL POLISHING; DATA PROCESSING; DESIGN OF EXPERIMENTS; DYNAMICS; FORECASTING; NONLINEAR ANALYSIS; NONLINEAR FILTERING; PROCESS MONITORING; REGRESSION ANALYSIS; SENSORS; SURFACE DEFECTS; SURFACES; VENTILATION EXHAUSTS;

VIBRATION ANALYSIS;

EID: 77951985193     PISSN: 08946507     EISSN: None     Source Type: Journal    
DOI: 10.1109/TSM.2010.2046110     Document Type: Conference Paper

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