On the wafer/pad friction of chemical-mechanical planarization (CMP) processes - Part I: Modeling and analysis

IEEE Transactions on Semiconductor Manufacturing

Volumn 18, Issue 3, 2005, Pages 359-370

  Yi, Jingang ^a  

^a Texas AandM University   (United States)

Author keywords

Chemical mechanical planarization (CMP); Friction; LuGre friction model; Process modeling and monitoring; Shallow trench isolation (STI)

Indexed keywords

COMPUTER SIMULATION; KINEMATICS; MATHEMATICAL MODELS; SILICON WAFERS; TORQUE;

CHEMICAL-MECHANICAL PLANARIZATION (CMP); LUGRE FRICTION MODEL; PROCESS MODELING AND MONITORING; SHALLOW TRENCH ISOLATION (STI);

FRICTION;

EID: 25144450473     PISSN: 08946507     EISSN: None     Source Type: Journal    
DOI: 10.1109/TSM.2005.852101     Document Type: Article

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