Chemical mechanical planarization of copper damascene structures

Journal of the Electrochemical Society

Volumn 147, Issue 2, 2000, Pages 706-712

  Wrschka, P ^a,b   Hernandez, J ^a   Oehrlein, G S ^a   King, J ^a  

^a STATE UNIVERSITY OF NEW YORK   (United States)

^b Cybeq Nano Technologies   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; CONTAMINATION; COPPER CORROSION; ELECTROCHEMISTRY; ETCHING; INTEGRATED CIRCUITS; SCANNING ELECTRON MICROSCOPY; SILICA; SURFACE TOPOGRAPHY; TANTALUM;

CHEMICAL MECHANICAL PLANARIZATION; COPPER DAMASCENE STRUCTURES; PLANARIZED STRUCTURE; SPACER EROSION;

COPPER;

EID: 0034140737     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1393256     Document Type: Article

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