Effect of homogenization on the indentation creep of cast lead-free Sn-5%Sb solder alloy

Journal of Electronic Materials

Volumn 36, Issue 12, 2007, Pages 1703-1710

  Mahmudi, R ^a   Geranmayeh, A R ^b   Allami, M ^a   Bakherad, M ^a  

^a UNIVERSITY OF TEHRAN   (Iran)

^b ISLAMIC AZAD UNIVERSITY   (Iran)

Author keywords

Hardness; Indentation creep; Lead free solder; Sn Sb alloy

Indexed keywords

CAST MATERIALS; DISLOCATION CREEP; POWER LAW CREEP RELATIONSHIPS; VICKERS INDENTATION TESTING;

ACTIVATION ENERGY; CREEP; INDENTATION; SOLDERING ALLOYS; STRESS ANALYSIS;

ANTIMONY ALLOYS;

EID: 36148997984     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-007-0275-5     Document Type: Article

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