Effect of stress and strain state on heterogeneous coarsening in Sn-Pb solder

Acta Materialia

Volumn 54, Issue 1, 2006, Pages 197-207

  Woodmansee, M W ^a   Neu, R W ^a,b  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b Georgia Institute of Technology   (United States)

Author keywords

Coarsening; Creep; Mechanical properties testing; Recrystallized microstructure

Indexed keywords

BINARY ALLOYS; COMPACTION; CREEP; DEFORMATION; MECHANICAL TESTING; MICROSTRUCTURE; RECRYSTALLIZATION (METALLURGY); STRAIN; STRESS ANALYSIS;

COARSENING; MECHANICAL PROPERTIES TESTING; RECRYSTALLIZED MICROSTRUCTURE; UNIAXIAL COMPRESSION;

SOLDERING ALLOYS;

EID: 27744591385     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2005.08.042     Document Type: Article

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