How to extract continuum materials properties for (lead-free) solders from tensile tests and nanoindentation experiments

Microsystem Technologies

Volumn 15, Issue 1 SPEC. ISS., 2009, Pages 45-55

  Muller W H ^a   Worrack, H ^a   Sterthaus, J ^b   Villain, J ^c   Wilden, J ^a   Juritza, A ^a  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

^b BAM FEDERAL INSTITUTE FOR MATERIALS RESEARCH AND TESTING   (Germany)

^c AUGSBURG UNIVERSITY OF APPLIED SCIENCES   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; BRAZING; CONCRETE AGGREGATES; CURVE FITTING; ELASTIC MODULI; ELASTICITY; ELECTRONICS INDUSTRY; EXPERIMENTS; EXTRACTION; HARDNESS; INVERSE PROBLEMS; JOINING; LEAD; MECHANICAL PROPERTIES; NANOINDENTATION; POLYMER BLENDS; SOLDERING ALLOYS; STRESS-STRAIN CURVES; STRESSES; TENSILE TESTING; TESTING; WELDING; YIELD STRESS;

AXIAL LOADINGS; ELECTRONIC PRODUCTS; EXPERIMENTAL DATUM; EXPERIMENTAL INVESTIGATIONS; FINITE ELEMENTS; INVERSE METHODS; LEAD-FREE; LINEAR RELATIONSHIPS; MANUFACTURING PROCESSES; MATERIAL CHARACTERIZATIONS; MATERIAL PROPERTIES; MEASURED PROPERTIES; MEASURING; MICROELECTRONIC COMPONENTS; MINIATURE TESTS; NANOINDENTATION EXPERIMENTS; NANOINDENTER; OPTIMIZATION ROUTINES; SOLDER JOINTS; SOLDER MATERIALS; SPECIMEN LENGTHS; STRESS-STRAIN; TENSILE TESTS; TWO MATERIALS; YOUNG'S MODULUS;

MATERIALS PROPERTIES;

EID: 54049132041     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-008-0688-y     Document Type: Conference Paper

References (7)

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