Scratch properties of nickel thin films using atomic force microscopy

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 28, Issue 1, 2010, Pages 202-210

  Tseng, Ampere A ^a   Shirakashi, Jun Ichi ^b   Jou, Shyankay ^c   Huang, Jen Ching ^d   Chen, T P ^e  

^a Arizona State University   (United States)

^b TOKYO UNIVERSITY OF AGRICULTURE AND TECHNOLOGY   (Japan)

^c NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

^d TUNGNAN UNIVERSITY   (Taiwan)

^e NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ACCURACY AND PRECISION; AFM TIP; CORRELATION FORMULAE; MACHINING TOOL; NANO SCALE; NI THIN FILMS; NICKEL THIN FILM; ORDER OF MAGNITUDE; PRIMARY FACTORS; TIP FORCES;

MACHINING; NANOSTRUCTURED MATERIALS; NICKEL ALLOYS; THIN FILMS;

ATOMIC FORCE MICROSCOPY;

EID: 77949404352     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.3292944     Document Type: Conference Paper

References (37)

1. S. Basrour and L. Robert, Mater. Sci. Eng., A MSAPE3 0921-5093 288, 270 (2000). 10.1016/S0921-5093(00)00868-6
2. H. S. Cho, K. J. Hemker, K. Lian, and J. Goettert, Proceedings of the 15th IEEE International Conference on MEMS 2002 (IEEE, Piscataway, 2002), p. 439.
3. J. A. Van Kan, P. G. Shao, K. Ansari, A. A. Bettiol, T. Osipowicz, and F. Watt, Microsyst. Technol. MCTCEF 0946-7076 13, 431 (2007). 10.1007/s00542-006- 0192-1
4. D. Wang, L. Cao, C. -Q. Xie, M. Liu, and T. -C. Ye, J. Microlithogr., Microfabr., Microsyst. JMMMGF 1537-1646 5, 013002 (2006). 10.1117/1.2170110
5. A. A. Tseng, Small SMALBC 1613-6810 1, 594 (2005). 10.1002/smll.200500050
6. H. Ono, S. Shoji, J. Mizuno, and M. Saito, in The Fourth International Conference on Networked Sensing Systems, INSS (Institute of Electrical and Electronics Engineers Computer Society, Piscataway, 2007), p. 130.
7. S. -H. Hong, K. -S. Han, K. -J. Byeon, H. Lee, and K. -W. Choi, Jpn. J. Appl. Phys. JJAPA5 0021-4922 47, 3699 (2008). 10.1143/JJAP.47.3699
8. C. -J. Ting, H. -Y. Tsai, and C. -P. Chou, Key Eng. Mater. KEMAEY 1013-9826 364-366 I, 607 (2008). 10.4028/www.scientific.net/KEM.364-366.607
9. I. W. Moran, A. L. Briseno, S. Loser, and K. R. Carter, Chem. Mater. CMATEX 0897-4756 20, 4595 (2008). 10.1021/cm800480z
10. K. P. Larsen, J. T. Ravnkilde, M. Ginnerup, and O. Hansen, in Proceedings of the 15th IEEE Micro Electro Mechanical Systems (MEMS) (IEEE, Piscataway, 2002), p. 443.
11. K. -S. Teh, Y. -T. Cheng, and L. Lin, J. Micromech. Microeng. JMMIEZ 0960-1317 15, 2205 (2005). 10.1088/0960-1317/15/12/001
12. L. Almeida, R. Ramadoss, R. Jackson, K. Ishikawa, and Q. Yu, J. Micromech. Microeng. JMMIEZ 0960-1317 16, 1189 (2006). 10.1088/0960-1317/16/7/ 011
13. A. A. Tseng, A. Notargiacomo, and T. P. Chen, J. Vac. Sci. Technol. B JVTBD9 1071-1023 23, 877 (2005). 10.1116/1.1926293
14. A. A. Tseng, J. Shirakashi, S. Nishimura, K. Miyashita, and A. Notargiacomo, J. Appl. Phys. JAPIAU 0021-8979 106, 044314 (2009). 10.1063/1.3197313
15. L. Santinacci, Y. Zhang, and P. Schmuki, Surf. Sci. SUSCAS 0039-6028 597, 11 (2005). 10.1016/j.susc.2005.05.069
16. N. X. Randall, G Favaro, and C. H. Frankel, Surf. Coat. Technol. SCTEEJ 0257-8972 137, 146 (2001). 10.1016/S0257-8972(00)01097-5
17. N. Yasui, H. Inaba, K. Furusawa, M. Saito, and N. Ohtake, IEEE Trans. Magn. IEMGAQ 0018-9464 45, 805 (2009). 10.1109/TMAG.2008.2010636
18. M. V. H. Rao, V. Srinivas, V. V. Rao, B. K. Mathur, and K. L. Chopra, Appl. Surf. Sci. ASUSEE 0169-4332 89, 417 (1995). 10.1016/0169-4332(95)00070-4
19. S. Kassavetis, K. Mitsakakis, and S. Logothetidis, Mater. Sci. Eng., C MSCEEE 0928-4931 27, 1456 (2007). 10.1016/j.msec.2006.08.004
20. J. A. Schey, Introduction to Manufacturing Processes, 3rd ed. (McGraw-Hill, New York, 2000).
21. N. Kawasegi, ASME J. Manuf. Sci. Eng. JMSEFK 1087-1357 128, 723 (2006). 10.1115/1.2163364
22. N. Kawasegi, N. Morita, S. Yamada, N. Takano, T. Oyama, and K. Ashida, Int. J. Mach. Mach. Mater. ZZZZZZ 1748-5711 2, 3 (2007). 10.1504/IJMMM.2007. 012663
23. A. A. Tseng, J. Shirakashi, S. Nishimura, K. Miyashita, and Z. Li, J. Nanosci. Nanotechnol. JNNOAR 1533-4880 10, 456 (2010).
24. A. A. Tseng, K. P. Jen, T. C. Chen, R. Kondetimmamhalli, and Y. V. Murty, Metall. Mater. Trans. A MMTAEB 1073-5623 26, 2111 (1995). 10.1007/BF02670682
25. H. D. F. Filho, M. H. P. Mauricio, C. R. Ponciano, and R. Prioli, Mater. Sci. Eng., B MSBTEK 0921-5107 112, 194 (2004). 10.1016/j.mseb.2004.05.031
26. B. Mills and A. H. Redford, Machinability of Engineering Materials (Applied Science, London, 1983).
27. Z. Kato, M. Sakairi, and H. Takahashi, Surf. Coat. Technol. SCTEEJ 0257-8972 169-170, 195 (2003). 10.1016/S0257-8972(03)00061-6
28. E. Rabinowicz, Friction and Wear of Materials (Wiley, New York, 1995).
29. K. Cheng, X. Luo, R. Ward, and R. Holt, Wear WEARCJ 0043-1648 255, 1427 (2003). 10.1016/S0043-1648(03)00178-9
30. J. F. Archard, J. Appl. Phys. JAPIAU 0021-8979 24, 981 (1953). 10.1063/1.1721448
31. Name after H. Hertz, whose work was originally published in 1881; see S. P. Timoshenko and J. N. Goodier, Theory of Elasticity, 3rd ed. (McGraw-Hill, New York, 1970).
32. C. Klein, Mater. Res. Bull. MRBUAC 0025-5408 27, 1407 (1992). 10.1016/0025-5408(92)90005-K
33. T. Namazu and S. Inoue, Fatigue Fract. Eng. Mater. Struct. FFESEY 8756-758X 30, 13 (2007). 10.1111/j.1460-2695.2006.01043.x
34. Y. D. Yan, T. Sun, X. S. Zhao, Z. J. Hu, and S. Dong, J. Micromech. Microeng. JMMIEZ 0960-1317 18, 035002 (2008). 10.1088/0960-1317/18/3/035002
35. J. Lamovec, V. Jović, D. Randjelović, R. Aleksić, and V. Radojević, Thin Solid Films THSFAP 0040-6090 516, 8646 (2008). 10.1016/j.tsf.2008.06.035
36. L. Xiaodoing and B. Bhushan, Thin Solid Films THSFAP 0040-6090 340, 210 (1999). 10.1016/S0040-6090(98)01153-5
37. M. C. Kong, W. B. Lee, C. F. Cheung, and S. To, J. Mater. Process. Technol. JMPTEF 0924-0136 180, 210 (2006). 10.1016/j.jmatprotec.2006.06.006