MEMS fabrication based on nickel-nanocomposite: Film deposition and characterization

Journal of Micromechanics and Microengineering

Volumn 15, Issue 12, 2005, Pages 2205-2215

  Teh, Kwok Siong ^a   Cheng, Yu Ting ^b   Lin, Liwei ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; DEPOSITION; NANOSTRUCTURED MATERIALS; NICKEL; THERMAL EXPANSION;

CORDIERITE; ELECTROLESS NICKEL (EN); NANODIAMOND PARTICLES; ON-CHIP DEPOSITION;

MICROELECTROMECHANICAL DEVICES;

EID: 27944466029     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/15/12/001     Document Type: Article

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