Study of the electrical contact resistance of multi-contact MEMS relays fabricated using the MetalMUMPs process

Journal of Micromechanics and Microengineering

Volumn 16, Issue 7, 2006, Pages 1189-1194

  Almeida, L ^a   Ramadoss, R ^a   Jackson, R ^a   Ishikawa, K ^b   Yu, Q ^b  

^a AUBURN UNIVERSITY   (United States)

^b YOKOHAMA NATIONAL UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ACTUATORS; DEGRADATION; ELECTRIC POTENTIAL; GOLD; MICROELECTROMECHANICAL DEVICES; NICKEL; OHMIC CONTACTS;

ACTUATION CYCLES; ELECTRICAL CONTACT SURFACES; MULTI-CONTACT MEMS RELAYS; OHMIC CONTACT TYPE MEMS RELAYS;

ELECTRIC RESISTANCE;

EID: 33745079567     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/16/7/011     Document Type: Article

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