Interfacial interaction of solid cobalt with liquid Pb-free Sn-Bi-In-Zn-Sb soldering alloys

Journal of Materials Science

Volumn 44, Issue 22, 2009, Pages 5960-5979

  Dybkov, V I ^a   Khoruzha, V G ^a   Sidorko, V R ^a   Meleshevich, K A ^a   Samelyuk, A V ^a   Berry, D C ^b   Barmak, K ^b  

^a FRANTSEVICH INSTITUTE FOR PROBLEMS OF MATERIALS SCIENCE   (Ukraine)

^b CARNEGIE MELLON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ARRHENIUS; DIPPING TIME; DISSOLUTION KINETICS; DISSOLUTION RATES; HIGHER TEMPERATURES; INTERFACIAL INTERACTION; INTERMETALLIC LAYER; LAYER THICKNESS; MATHEMATICAL EQUATIONS; PB-FREE; PHASE FORMATIONS; RELATIVE ELONGATIONS; ROTATIONAL SPEED; SOLDER INTERFACES; SOLDER JOINTS; TEMPERATURE DEPENDENCE; TEMPERATURE RANGE;

ALLOYS; CERIUM ALLOYS; COBALT; DISSOLUTION; LEAD; LIQUIDS; PHASE INTERFACES; RATE CONSTANTS; SOLDERING; SOLUTIONS; TENSILE STRENGTH; TIN; TIN ALLOYS; ZINC;

SOLDERING ALLOYS;

EID: 70349481283     PISSN: 00222461     EISSN: 15734803     Source Type: Journal    
DOI: 10.1007/s10853-009-3717-z     Document Type: Article

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