Intermetallic compounds formed during interfacial reactions between liquid Sn-8Zn-3Bi solders and Ni substrates

Journal of Electronic Materials

Volumn 31, Issue 5, 2002, Pages 494-499

  Chiu, M Y ^a   Wang, S S ^a   Chuang, T H ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

Intermetallic compound; Linear growth kinetics; Nickel substrate; Sn 8Zn 3Bi solder

Indexed keywords

BONDING; INTERFACES (MATERIALS); NICKEL; RATE CONSTANTS; RECYCLING; SOLDERING ALLOYS; SUBSTRATES; SURFACE REACTIONS; THERMAL EFFECTS; TIN ALLOYS;

BACKING PLATE MATERIALS; BONDING RECYCLED SPUTTERING TARGETS;

INTERMETALLICS;

EID: 0036575443     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-002-0105-8     Document Type: Article

References (16)