Dissolution kinetics and diffusion of cobalt in Pb-free Sn-Bi-ln-Zn-Sb soldering alloys

Materials Science and Technology Conference and Exhibition, MS and T'08

Volumn 1, Issue , 2008, Pages 262-273

  Barmak, K ^a   Berry, D C ^a   Khoruzha, V G ^b   Sidorko, V R ^b   Meleshevich, K A ^b   Samelyuk, A V ^b   Dybkov, V I ^b  

^a CARNEGIE MELLON UNIVERSITY   (United States)

^b FRANTSEVICH INSTITUTE FOR PROBLEMS OF MATERIALS SCIENCE   (Ukraine)

Author keywords

Cobalt; Diffusion coefficients; Dissolution kinetics; Pb free Sn Bi ln Zn Sb solders

Indexed keywords

ARRHENIUS; DIFFUSION COEFFICIENTS; DISSOLUTION KINETICS; DISSOLUTION RATES; INTERMETALLIC LAYERS; PB-FREE SN-BI-LN-ZN-SB SOLDERS; ROTATIONAL SPEED; SOLDER INTERFACES; TEMPERATURE DEPENDENCES;

ALLOYS; BRAZING; CERIUM ALLOYS; CESIUM; COBALT; DIFFUSION; DISSOLUTION; LEAD; LEAD ALLOYS; PHASE INTERFACES; RATE CONSTANTS; SOLUTIONS; TIN; TIN ALLOYS; TITANIUM COMPOUNDS; WELDING; ZINC;

SOLDERING ALLOYS;

EID: 63749117834     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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