-
1
-
-
33750463782
-
Intermetallic compound formation in Sn-Co-Cu, Sn-Ag-Cu and eutectic Sn-Cu solder joints on electroless Ni(P) immersion Au surface finish after reflow soldering
-
P. Sun, C. Anderson, X. Wei, Z. Cheng, D. Shangguan, and J. Liu: Intermetallic compound formation in Sn-Co-Cu, Sn-Ag-Cu and eutectic Sn-Cu solder joints on electroless Ni(P) immersion Au surface finish after reflow soldering. Mater. Sci. Eng., B 135, 134 (2006).
-
(2006)
Mater. Sci. Eng., B
, vol.135
, pp. 134
-
-
Sun, P.1
Anderson, C.2
Wei, X.3
Cheng, Z.4
Shangguan, D.5
Liu, J.6
-
2
-
-
23844524506
-
Electroless Co-P for diffusion barrier in Pb-free soldering
-
L. Magagnin, V. Sirtori, S. Seregni, A. Origo, and P.L. Cavallotti: Electroless Co-P for diffusion barrier in Pb-free soldering. Electrochim. Acta 50, 4621 (2005).
-
(2005)
Electrochim. Acta
, vol.50
, pp. 4621
-
-
Magagnin, L.1
Sirtori, V.2
Seregni, S.3
Origo, A.4
Cavallotti, P.L.5
-
5
-
-
30844443507
-
Reactivity between Sn-Ag solder and Au/Ni-Co plating to form intermetallic phases
-
T. Yamamoto, S. Sakatani, S. Kobayashi, K. Uenishi, K. Kobayashi, M. Ishio, K. Shiomi, A. Hashimoto, and M. Yamamoto: Reactivity between Sn-Ag solder and Au/Ni-Co plating to form intermetallic phases. Mater. Trans. 46, 2406 (2005).
-
(2005)
Mater. Trans
, vol.46
, pp. 2406
-
-
Yamamoto, T.1
Sakatani, S.2
Kobayashi, S.3
Uenishi, K.4
Kobayashi, K.5
Ishio, M.6
Shiomi, K.7
Hashimoto, A.8
Yamamoto, M.9
-
7
-
-
0037856414
-
The appearance of a high power of crystallization in the formation of iron-zinc alloys
-
E. Scheil: The appearance of a high power of crystallization in the formation of iron-zinc alloys. Z. Metallkd. 27, 76 (1935).
-
(1935)
Z. Metallkd
, vol.27
, pp. 76
-
-
Scheil, E.1
-
8
-
-
0000379245
-
The nature and growth of interaction layers formed during the reaction between solid titanium and liquid aluminium
-
J. Mackowiak and L.L. Shreir: The nature and growth of interaction layers formed during the reaction between solid titanium and liquid aluminium. J. Less-Common Met. 1, 456 (1959).
-
(1959)
J. Less-Common Met
, vol.1
, pp. 456
-
-
Mackowiak, J.1
Shreir, L.L.2
-
9
-
-
0033099521
-
Corrosion of martensitic and austenitic steels in liquid gallium
-
F. Barbier and J. Blanc: Corrosion of martensitic and austenitic steels in liquid gallium. J. Mater. Res. 14, 737 (1999).
-
(1999)
J. Mater. Res
, vol.14
, pp. 737
-
-
Barbier, F.1
Blanc, J.2
-
10
-
-
0037910160
-
Nature and growth of interaction layers formed during the reaction between solid Ni and liquid Al
-
Q. Xu, H. Zhang, B. Ding, and Z. Hu: Nature and growth of interaction layers formed during the reaction between solid Ni and liquid Al. J. Mater. Sci. Technol. 18, 512 (2002).
-
(2002)
J. Mater. Sci. Technol
, vol.18
, pp. 512
-
-
Xu, Q.1
Zhang, H.2
Ding, B.3
Hu, Z.4
-
11
-
-
33750521347
-
Unusual cruciform pattern interfacial reactions in Sn/Te couples
-
S-W. Chen and C-N. Chiu: Unusual cruciform pattern interfacial reactions in Sn/Te couples. Scripta Mater. 56, 97 (2007).
-
(2007)
Scripta Mater
, vol.56
, pp. 97
-
-
Chen, S.-W.1
Chiu, C.-N.2
-
12
-
-
37249014467
-
Interfacial reactions in the Sn-Bi/ Te couples. J. Electron. Mater., DOI: 10.1007/s11664-007-0264-8
-
accepted for publication
-
C-N. Chiu, C-H. Wang, and S-W. Chen: Interfacial reactions in the Sn-Bi/ Te couples. J. Electron. Mater., DOI: 10.1007/s11664-007-0264-8, (2007, accepted for publication).
-
(2007)
-
-
Chiu, C.-N.1
Wang, C.-H.2
Chen, S.-W.3
-
14
-
-
6344237225
-
A thermodynamic assessment of the Co-Sn system
-
M. Jiang, J. Sato, I. Ohnuma, R. Kainuma, and K. Ishida: A thermodynamic assessment of the Co-Sn system. Calphad 28, 20 (2004).
-
(2004)
Calphad
, vol.28
, pp. 20
-
-
Jiang, M.1
Sato, J.2
Ohnuma, I.3
Kainuma, R.4
Ishida, K.5
-
18
-
-
0032636251
-
Electric current effects on Sn/Ag interfacial reactions
-
C-M. Chen and S-W. Chen: Electric current effects on Sn/Ag interfacial reactions. J. Electron. Mater. 28, 902 (1999).
-
(1999)
J. Electron. Mater
, vol.28
, pp. 902
-
-
Chen, C.-M.1
Chen, S.-W.2
-
19
-
-
0032209640
-
Electric current effects upon the Sn/Cu and Sn/ Ni interfacial reactions
-
C-M. Chen and S-W. Chen: Electric current effects upon the Sn/Cu and Sn/ Ni interfacial reactions. J. Electron. Mater. 27, 1193 (1998).
-
(1998)
J. Electron. Mater
, vol.27
, pp. 1193
-
-
Chen, C.-M.1
Chen, S.-W.2
-
20
-
-
4944219736
-
Solid-state intermetallic compound layer growth between copper and 95.5Sn-3.9Ag-0.6Cu solder
-
P.T. Vianco, J.A. Rejent, and P.F. Hlava: Solid-state intermetallic compound layer growth between copper and 95.5Sn-3.9Ag-0.6Cu solder. J. Electron. Mater. 33, 991 (2004).
-
(2004)
J. Electron. Mater
, vol.33
, pp. 991
-
-
Vianco, P.T.1
Rejent, J.A.2
Hlava, P.F.3
-
21
-
-
35448932428
-
Dissolution and interfacial reactions of Fe in molten Sn-Cu and Sn-Pb solders
-
Y-C. Huang, S-W. Chen, W. Gierlotka, C-H. Chang, and J-C. Wu: Dissolution and interfacial reactions of Fe in molten Sn-Cu and Sn-Pb solders. J. Mater. Res. 22(10) 2924 (2007).
-
(2007)
J. Mater. Res
, vol.22
, Issue.10
, pp. 2924
-
-
Huang, Y.-C.1
Chen, S.-W.2
Gierlotka, W.3
Chang, C.-H.4
Wu, J.-C.5
-
22
-
-
4644302375
-
Stress-induced migration model based on atomic migration
-
M. Aoyagi: Stress-induced migration model based on atomic migration. J. Mater. Res. 19, 2349 (2004).
-
(2004)
J. Mater. Res
, vol.19
, pp. 2349
-
-
Aoyagi, M.1
|