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Volumn 22, Issue 12, 2007, Pages 3404-3409

Cruciform pattern formation in Sn/Co couples

Author keywords

[No Author keywords available]

Indexed keywords

CRACKS; PHASE TRANSITIONS;

EID: 37549029700     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2007.0422     Document Type: Article
Times cited : (27)

References (22)
  • 1
    • 33750463782 scopus 로고    scopus 로고
    • Intermetallic compound formation in Sn-Co-Cu, Sn-Ag-Cu and eutectic Sn-Cu solder joints on electroless Ni(P) immersion Au surface finish after reflow soldering
    • P. Sun, C. Anderson, X. Wei, Z. Cheng, D. Shangguan, and J. Liu: Intermetallic compound formation in Sn-Co-Cu, Sn-Ag-Cu and eutectic Sn-Cu solder joints on electroless Ni(P) immersion Au surface finish after reflow soldering. Mater. Sci. Eng., B 135, 134 (2006).
    • (2006) Mater. Sci. Eng., B , vol.135 , pp. 134
    • Sun, P.1    Anderson, C.2    Wei, X.3    Cheng, Z.4    Shangguan, D.5    Liu, J.6
  • 6
  • 7
    • 0037856414 scopus 로고
    • The appearance of a high power of crystallization in the formation of iron-zinc alloys
    • E. Scheil: The appearance of a high power of crystallization in the formation of iron-zinc alloys. Z. Metallkd. 27, 76 (1935).
    • (1935) Z. Metallkd , vol.27 , pp. 76
    • Scheil, E.1
  • 8
    • 0000379245 scopus 로고
    • The nature and growth of interaction layers formed during the reaction between solid titanium and liquid aluminium
    • J. Mackowiak and L.L. Shreir: The nature and growth of interaction layers formed during the reaction between solid titanium and liquid aluminium. J. Less-Common Met. 1, 456 (1959).
    • (1959) J. Less-Common Met , vol.1 , pp. 456
    • Mackowiak, J.1    Shreir, L.L.2
  • 9
    • 0033099521 scopus 로고    scopus 로고
    • Corrosion of martensitic and austenitic steels in liquid gallium
    • F. Barbier and J. Blanc: Corrosion of martensitic and austenitic steels in liquid gallium. J. Mater. Res. 14, 737 (1999).
    • (1999) J. Mater. Res , vol.14 , pp. 737
    • Barbier, F.1    Blanc, J.2
  • 10
    • 0037910160 scopus 로고    scopus 로고
    • Nature and growth of interaction layers formed during the reaction between solid Ni and liquid Al
    • Q. Xu, H. Zhang, B. Ding, and Z. Hu: Nature and growth of interaction layers formed during the reaction between solid Ni and liquid Al. J. Mater. Sci. Technol. 18, 512 (2002).
    • (2002) J. Mater. Sci. Technol , vol.18 , pp. 512
    • Xu, Q.1    Zhang, H.2    Ding, B.3    Hu, Z.4
  • 11
    • 33750521347 scopus 로고    scopus 로고
    • Unusual cruciform pattern interfacial reactions in Sn/Te couples
    • S-W. Chen and C-N. Chiu: Unusual cruciform pattern interfacial reactions in Sn/Te couples. Scripta Mater. 56, 97 (2007).
    • (2007) Scripta Mater , vol.56 , pp. 97
    • Chen, S.-W.1    Chiu, C.-N.2
  • 12
    • 37249014467 scopus 로고    scopus 로고
    • Interfacial reactions in the Sn-Bi/ Te couples. J. Electron. Mater., DOI: 10.1007/s11664-007-0264-8
    • accepted for publication
    • C-N. Chiu, C-H. Wang, and S-W. Chen: Interfacial reactions in the Sn-Bi/ Te couples. J. Electron. Mater., DOI: 10.1007/s11664-007-0264-8, (2007, accepted for publication).
    • (2007)
    • Chiu, C.-N.1    Wang, C.-H.2    Chen, S.-W.3
  • 18
    • 0032636251 scopus 로고    scopus 로고
    • Electric current effects on Sn/Ag interfacial reactions
    • C-M. Chen and S-W. Chen: Electric current effects on Sn/Ag interfacial reactions. J. Electron. Mater. 28, 902 (1999).
    • (1999) J. Electron. Mater , vol.28 , pp. 902
    • Chen, C.-M.1    Chen, S.-W.2
  • 19
    • 0032209640 scopus 로고    scopus 로고
    • Electric current effects upon the Sn/Cu and Sn/ Ni interfacial reactions
    • C-M. Chen and S-W. Chen: Electric current effects upon the Sn/Cu and Sn/ Ni interfacial reactions. J. Electron. Mater. 27, 1193 (1998).
    • (1998) J. Electron. Mater , vol.27 , pp. 1193
    • Chen, C.-M.1    Chen, S.-W.2
  • 20
    • 4944219736 scopus 로고    scopus 로고
    • Solid-state intermetallic compound layer growth between copper and 95.5Sn-3.9Ag-0.6Cu solder
    • P.T. Vianco, J.A. Rejent, and P.F. Hlava: Solid-state intermetallic compound layer growth between copper and 95.5Sn-3.9Ag-0.6Cu solder. J. Electron. Mater. 33, 991 (2004).
    • (2004) J. Electron. Mater , vol.33 , pp. 991
    • Vianco, P.T.1    Rejent, J.A.2    Hlava, P.F.3
  • 21
    • 35448932428 scopus 로고    scopus 로고
    • Dissolution and interfacial reactions of Fe in molten Sn-Cu and Sn-Pb solders
    • Y-C. Huang, S-W. Chen, W. Gierlotka, C-H. Chang, and J-C. Wu: Dissolution and interfacial reactions of Fe in molten Sn-Cu and Sn-Pb solders. J. Mater. Res. 22(10) 2924 (2007).
    • (2007) J. Mater. Res , vol.22 , Issue.10 , pp. 2924
    • Huang, Y.-C.1    Chen, S.-W.2    Gierlotka, W.3    Chang, C.-H.4    Wu, J.-C.5
  • 22
    • 4644302375 scopus 로고    scopus 로고
    • Stress-induced migration model based on atomic migration
    • M. Aoyagi: Stress-induced migration model based on atomic migration. J. Mater. Res. 19, 2349 (2004).
    • (2004) J. Mater. Res , vol.19 , pp. 2349
    • Aoyagi, M.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.