The growth kinetics of intermetallic layers at the interface of a solid metal and a liquid solder

JOM

Volumn 61, Issue 1, 2009, Pages 76-79

  Dybkov, V I ^a  

^a FRANTSEVICH INSTITUTE FOR PROBLEMS OF MATERIALS SCIENCE   (Ukraine)

Author keywords

[No Author keywords available]

Indexed keywords

INTERMETALLIC LAYER; LAYER THICKNESS; LIQUID SOLDERS; LIQUID STATE; MATHEMATICAL EQUATIONS; PHASE FORMATIONS; SOLDER INTERFACES; SOLID METALS;

BRAZING; DISSOLUTION; GROWTH KINETICS; LIQUIDS; METAL RECOVERY; SMELTING; SOLDERING ALLOYS; TIN; WELDING;

PHASE INTERFACES;

EID: 67649438857     PISSN: 10474838     EISSN: 15431851     Source Type: Journal    
DOI: 10.1007/s11837-009-0015-9     Document Type: Article

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