Formation of intermetallic compound (IMC) between Sn and Co substrate

Journal of Alloys and Compounds

Volumn 456, Issue 1-2, 2008, Pages 113-117

  Zhu, WenJun ^a   Liu, HuaShan ^a   Wang, Jiang ^a   Jin, ZhanPeng ^a  

^a CENTRAL SOUTH UNIVERSITY   (China)

Author keywords

Diffusion; Interfacial reaction; Intermetallic compound

Indexed keywords

NUCLEATION; SUBSTRATES; SURFACE CHEMISTRY; TEMPERATURE DISTRIBUTION; TIN;

REACTION COUPLES; RELATIVE STABILITY;

INTERMETALLICS;

EID: 41549130297     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2007.02.022     Document Type: Article

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