Selective interfacial reaction between Ni and eutectic BiSn lead-free solder

Chemistry of Materials

Volumn 13, Issue 3, 2001, Pages 1051-1056

  Tao, W H ^a   Chen, C ^b   Ho, C E ^b   Chen, W T ^b   Kao, C R ^b  

^a CHINESE CULTURE UNIVERSITY   (Taiwan)

^b NATIONAL CENTRAL UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BISMUTH; LEAD; NICKEL; TIN;

ANALYTIC METHOD; ARTICLE; CHEMICAL REACTION; COMPLEX FORMATION; ELECTRONICS; REACTION ANALYSIS; THERMODYNAMICS; WETTABILITY;

EID: 0034846753     PISSN: 08974756     EISSN: None     Source Type: Journal    
DOI: 10.1021/cm000803l     Document Type: Article

References (16)