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Volumn 44, Issue 1, 2009, Pages 149-153
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Bismuth redistribution induced by intermetallic compound growth in SnBi/Cu microelectronic interconnect
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Author keywords
[No Author keywords available]
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Indexed keywords
BISMUTH;
BISMUTH COMPOUNDS;
CRYSTALLITES;
DIFFUSION;
INTERMETALLICS;
NANOCRYSTALLINE ALLOYS;
TIN;
AGING PROCESSES;
INTERMETALLIC COMPOUND GROWTHS;
KIRKENDALL EFFECTS;
ROOM TEMPERATURES;
COPPER;
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EID: 58149513085
PISSN: 00222461
EISSN: 15734803
Source Type: Journal
DOI: 10.1007/s10853-008-3118-8 Document Type: Article |
Times cited : (34)
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References (22)
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