Metallurgical behavior of Au/Al bond interface during high temperature storage of ultrasonic wedge bonding

2006 7th International Conference on Electronics Packaging Technology, ICEPT '06

Volumn , Issue , 2007, Pages

  Mingyu, Li ^a   Song, Li ^a   Hongjun, Ji ^b  

^a Shenzhen University Town   (China)

^b HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

HIGH TEMPERATURE EFFECTS; INTERFACES (MATERIALS); METALLIZING; SCANNING ELECTRON MICROSCOPY; ULTRASONICS;

JOINT CROSS-SECTION; ROOM TEMPERATURE; ULTRASONIC WEDGE BONDING;

WAFER BONDING;

EID: 34948817083     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2006.359783     Document Type: Conference Paper

References (8)

1. Antonevich, Monroe R. E., "Fundamental Studies of Ultrasonic Welding", Welding Journal Research Supplemen, Vol. 8, No. 3 (1960), pp. 125-136.
2. "Catching up to Flip Chip Technology", Connections Magazine, Vol. 1 (2001), 36-41.
3. Joshi K.C., "The Formation of Ultrasonic Bonds Between Metals", Welding Journal, Vol. 10, NO. 50 (1971), 840-848.
4. Harman G.G., Albers J., "The Ultrasonic Welding Mechanism as Applied to Aluminum-and Gold-Wire Bonding in Microelectronics", IEEE Trans. PHP, Vol. 13, No. 4 (1997), 406-412.
5. Jin Onuki, Masahiro Koizumi, Masateru Suwa, "Reliability of Thick Al Wire Bonds in IGBT Modules for Traction Motor Drives", IEEE Trans. Advanced Packaging, Vol. 23, No. 1 (2000), 108-112.
6. 4Al", Microelectronics Reliability, Vol. 44, No. 6 (2004), 973-981.
7. Philofsky E., "Intermetallic Formation in Gold-Aluminum Systems", Solid State Electron., Vol. 13, No. 10 (1970), 1391-1399.
8. Brandes E.A., Smithells Metals Reference Book, 6th edition. Butterworths (UK, London, 1983), chapter 13-14-chapter 13-15.