The viability of anisotropic conductive film as a flip chip interconnect technology for MEMS devices

Journal of Micromechanics and Microengineering

Volumn 15, Issue 6, 2005, Pages 1131-1139

  Pai, Rekha S ^a   Walsh, Kevin M ^a  

^a University of Louisville   (United States)

Author keywords

Anisotropic conductive film; Contact resistance; Flip chip; MEMS; Packaging; Parylene; Pressure sensor

Indexed keywords

ANISOTROPY; BONDING; CAPACITANCE; CONDUCTIVE FILMS; DIES; ELECTRIC POTENTIAL; ELECTRIC RESISTANCE; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; SENSORS;

ANISOTROPIC CONDUCTIVE FILM (ACF); CONTACT RESISTANCE; MECHANICAL STABILITY; STUD BUMPING;

MICROELECTROMECHANICAL DEVICES;

EID: 18744414493     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/15/6/003     Document Type: Article

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