Transfer of metal MEMS packages using a wafer-level solder transfer technique

IEEE Transactions on Advanced Packaging

Volumn 28, Issue 4, 2005, Pages 643-649

  Welch III, Warren C ^a   Chae, Junseok ^a   Najafi, Khalil ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

Diffusion soldering; Microelectromechanical systems (MEMS) packaging; Transferred thin film packaging; Transient liquid phase bonding

Indexed keywords

BONDING; ELECTRONICS PACKAGING; ELECTROPLATING; LEAD ALLOYS; NICKEL; SOLDERING; THIN FILMS;

DIFFUSION SOLDERING; TRANSFERRED THIN FILM PACKAGING; TRANSIENT LIQUID PHASE BONDING;

MICROELECTROMECHANICAL DEVICES;

EID: 28444454086     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2005.859356     Document Type: Article

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