High density interconnects and flexible hybrid assemblies for active biomedical implants

IEEE Transactions on Advanced Packaging

Volumn 24, Issue 3, 2001, Pages 366-374

  Meyer, Jörg Uwe ^a,b   Stieglitz, Thomas ^a,b   Scholz, Oliver ^b   Haberer, Werner ^b   Beutel, Hansjoergl ^b  

^a IEEE   (Germany)

^b FRAUNHOFER INSTITUTE FOR BIOMEDICAL ENGINEERING   (Germany)

Author keywords

Biomedical microdevices; Electromechanical contact; Flexible substrates; High density interconnects; High density packaging; Microassembly; Microimplants; Neuroprosthetics; Polyimide; Retina implant

Indexed keywords

FLEXIBLE HYBRID ASSEMBLIES; HIGH DENSITY INTERCONNECTS; MICROASSEMBLY; MICROFLEX INTERCONNECTION; MICROIMPLANTS; RETINA IMPLANT; ULTRA THIN SUBSTRATES;

BIOCOMPATIBILITY; CHIP SCALE PACKAGES; ELECTRODES; ELECTRONIC EQUIPMENT TESTING; ELECTRONIC MEDICAL EQUIPMENT; IMPLANTS (SURGICAL); MECHANICAL TESTING; MICROELECTRONIC PROCESSING; PHOTOLITHOGRAPHY; POLYIMIDES; SPUTTERING; SUBSTRATES;

MICROPROCESSOR CHIPS;

EID: 0035422827     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.938305     Document Type: Article

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