Electrical characterization of NCP- and NCF-bonded fine-pitch flip-chip-on-flexible packages

IEEE Transactions on Advanced Packaging

Volumn 29, Issue 4, 2006, Pages 735-740

  Chan, Y C ^a   Tan, S C ^a   Lui, Nelson S M ^b   Tan, C W ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^b Varitronix Limited   (Hong Kong)

Author keywords

Contact resistance; Fine pitch application; Nonconducting adhesive

Indexed keywords

ADHESIVE PASTES; ELASTIC MODULI; ELECTRIC CONDUCTIVITY; FILMS; FLIP CHIP DEVICES; RHEOLOGY; SCANNING ELECTRON MICROSCOPY; STIFFNESS;

FINE-PITCH APPLICATION; FLIP-CHIP-ON-FLEXIBLE PACKAGES; NONCONDUCTIVE FILM; NONCONDUCTIVE PASTE;

CHIP SCALE PACKAGES;

EID: 37849188000     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2006.884814     Document Type: Article

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