3-D-Integrated RF and millimeter-wave functions and modules using liquid crystal polymer (LCP) system-on-package technology

IEEE Transactions on Advanced Packaging

Volumn 27, Issue 2, 2004, Pages 332-340

  Tentzeris, Manos M ^a   Laskar, Joy ^a   Papapolymerou, John ^a   Pinel, Stéphane ^a   Palazzari, V ^a   Li, R ^a   DeJean, G ^a   Papageorgiou, N ^a   Thompson, D ^a   Bairavasubramanian, R ^a   Sarkar, S ^a   Lee, J H ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANTENNA ARRAYS; BANDPASS FILTERS; BANDWIDTH; ELECTRIC INDUCTORS; ELECTROMAGNETIC WAVE POLARIZATION; INSERTION LOSSES; LIQUID CRYSTAL POLYMERS; MILLIMETER WAVE DEVICES; MULTILAYERS; SUBSTRATES; THREE DIMENSIONAL; WIRELESS TELECOMMUNICATION SYSTEMS;

BALL GRID ARRAY; DUAL BAND ANTENNA; DUAL BAND FILTER; EMBEDDED FUNCTIONS; HIGH Q PASSIVES; MILLIMETER WAVE FRONT END MODULE; MULTILAYER MODULES; SYSTEM-ON-PACKAGE; THREE DIMENSIONAL INTEGRATION;

ELECTRONICS PACKAGING;

EID: 4544337744     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2004.828814     Document Type: Article

References (11)

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