The impact of thermal cycling regime on the shear strength of lead-free solder joints

Soldering and Surface Mount Technology

Volumn 17, Issue 2, 2005, Pages 22-31

  Dusek, Milos ^a   Wickham, Martin ^a   Hunt, Christopher ^a  

^a NATIONAL PHYSICAL LABORATORY   (United Kingdom)

Author keywords

Joining processes; Reliability management; Solders; Strength of materials

Indexed keywords

CRACK PROPAGATION; RESISTORS; SHEAR STRENGTH; STRENGTH OF MATERIALS; THERMAL CYCLING; THERMAL LOAD;

ACCELERATION FACTORS (AF); JOINING PROCESSES; RELIABILITY MANAGEMENT; THERMAL COEFFICIENTS OF EXPANSION (TCE);

SOLDERED JOINTS;

EID: 21044442241     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910510597474     Document Type: Article

References (10)

1. Clech, J.P. (2004), "An obstacle-controlled creep model for Sn-Pb and Sn-based lead-free solders", Proceedings of the 20th SMTA International Conference, Chicago, IL, pp. 776-802.
2. Dusek, M. and Hunt, C. (2000), "Best practice guide for thermal cycling and reliability assessment of solder joints", NPL Report CMMT(A)274.
3. Dusek, M. and Hunt, C. (2004), "Analytical model for thermal-cycling", NPL Report MATC(A)163.
4. Dusek, M., Nottay, J. and Hunt, C. (2000), "The use of shear testing and thermal cycling for the assessment of solder joint reliability", NPL Report CMMT(A)268.
5. Dusek, M., Nottay, J. and Hunt, C. (2001), "Compatibility of lead-free solders with PCB materials", NPL Report MATC (A) 89.
6. IPC (1992), Standard IPC SM 785: Guidelines For Accelerated Reliability Testing of Surface Mount Solder Attachments, Institute for Interconnecting and Packaging Electronic Circuits (IPC), Lincolnwood, IL.
7. Oliver, J., Nylen, M., Rod, O. and Markou, C. (2002), "Fatigue properties of Sn3.5Ag0.7Cu solder joints and effects of lead-contamination", Proceedings of the 18th SMTA International Conference, Chicago, IL, pp. 869-75.
8. Plumbridge, W., Matela, R. and Westwater, A. (2003), Structural Integrity and Reliability in Electronics, Kluwer Academic Publishers, Dordrecht.
9. Seelig, K. and Suraski, D. (2002), "Lead-free electronics assembly for the real world, joint failures, lead contamination and other important considerations", Proceedings of the IPC Apex 2002 Conference, San Diego, additional paper, pp. ADD-4-1.
10. Vincent, J. (1999), "Improved design life and environmentally aware manufacturing of electronics assemblies by lead-free soldering: 'IDEALS'", Synthesis report BRITE/EURAM project no. BE95-1994 from Marconi Materials Technology Limited available at: www.alphametals.com/products/leadfree/PDF/synthesis.pdf.