Effect of different temperature cycle profiles on the crack propagation and microstructural evolution of lead free solder joints of different electronic components

Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004

Volumn , Issue , 2004, Pages 455-464

  Andersson, Cristina ^a,b   Andersson, Dag R ^a,c   Tegehall, Per Erik ^a,c   Liu, Johan ^a,b,c  

^a Swed Microsyst Intgn Technol C   (Sweden)

^b CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^c SWEREA IVF   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

ARRAYS; COPPER COMPOUNDS; CRACK PROPAGATION; CRACKS; DUCTILITY; ELECTRONICS INDUSTRY; FINITE ELEMENT METHOD; INTERFACES (MATERIALS); LEAD ALLOYS; LOW TEMPERATURE EFFECTS; MICROSTRUCTURE; RESISTORS; STRAIN; STRESS ANALYSIS; SUBSTRATES; THERMAL EFFECTS;

CHIP RESISTORS; ELECTRONIC COMPONENTS; FINE ELEMENT MODELING (FEM); POWER CYCLE; REFLOW PROCESSES;

SOLDERED JOINTS;

EID: 3843126412     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

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