Isothermal mechanical durability of three selected PB-free solders: Sn3.9Ag0.6Cu, Sn3.5Ag, and Sn0.7Cu

Journal of Electronic Packaging

Volumn 127, Issue 4, 2005, Pages 512-522

  Zhang, Qian ^a,b   Dasgupta, Abhijit ^a   Haswell, Peter ^a,c  

^a UNIVERSITY OF MARYLAND   (United States)

^b DELL INC   (United States)

^c Hamilton Sundstrand Corporation   (New Zealand)

Author keywords

[No Author keywords available]

Indexed keywords

DURABILITY; ELECTRONICS INDUSTRY; LEAD; MATHEMATICAL MODELS; MECHANICAL PROPERTIES; STRAIN RATE;

CYCLIC WORK DENSITY; DAMAGE METRICS; ISOTHERMAL MECHANICAL DURABILITY; PB FREE SOLDERS;

SOLDERING ALLOYS;

EID: 29544437471     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.2056569     Document Type: Article

References (21)

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