Intermetallic compound formation in Sn-Co-Cu, Sn-Ag-Cu and eutectic Sn-Cu solder joints on electroless Ni(P) immersion Au surface finish after reflow soldering

Materials Science and Engineering: B

Volumn 135, Issue 2, 2006, Pages 134-140

  Sun, Peng ^a,c   Andersson, Cristina ^c   Wei, Xicheng ^a   Cheng, Zhaonian ^c   Shangguan, Dongkai ^b   Liu, Johan ^a,c  

^a SHANGHAI UNIVERSITY   (China)

^b FLEXTRONICS INTERNATIONAL   (United States)

^c CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

Author keywords

ENIG surface finish; Intermetallic compound (IMC); Lead free solder

Indexed keywords

EUTECTICS; INTERFACES (MATERIALS); MELTING; SOLDERED JOINTS; SURFACE TREATMENT; TIN COMPOUNDS;

ENIG SURFACE FINISH; INTERFACIAL IMC; LEAD-FREE SOLDER; REFLOW TIME;

INTERMETALLICS;

EID: 33750463782     PISSN: 09215107     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mseb.2006.08.051     Document Type: Article

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