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Proceedings of 4th Electronics Packaging Technology Conference, EPTC 2002

Volumn , Issue , 2002, Pages 1-5

An assessment of lead free solder (Sn3.7Ag0.8Cu) wettability

(4) Key Chung, C a Mustapha, F b Hua, F c Aspandiar, R d

a INTEL CORPORATION (United States)

b AMREC (Malaysia)

c Materials Technology Operation (United States)

d System Manufacturing Technology Division (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; GOLD COATINGS; NICKEL COATINGS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUITS; SOLDERED JOINTS; SOLDERING; SOLDERING ALLOYS; TIN; WETTING;

ELECTROLESS NICKEL IMMERSION GOLD; HOT-AIR SOLDER LEVELING; LASER MEASUREMENT SYSTEMS; NATIONAL ELECTRONICS MANUFACTURING INITIATIVES; ORGANIC SURFACES; OUTPUT PARAMETERS; PEAK TEMPERATURES; REFLOW TEMPERATURES;

LEAD-FREE SOLDERS;

EID: 84964621653 PISSN: None EISSN: None Source Type: Conference Proceeding
DOI: 10.1109/EPTC.2002.1185587 Document Type: Conference Paper

Times cited : (7)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.