Microstructure and interface reaction between Sn-3.5Ag solder and electroplated Ni layer on Cu substrate during high temperature exposure

Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability

Volumn , Issue , 2004, Pages 35-41

  Duan, L L ^a   Yu, D Q ^a   Han, S Q ^a   Zhao, J ^a   Wang, L ^a  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Electroplated Ni plating; Interface reaction; Intermetallic compound; Lead free solder; Microstructure; Sn 3.5Ag

Indexed keywords

AGING OF MATERIALS; DIFFUSION; ELECTROPLATING; INTERMETALLICS; LOW TEMPERATURE EFFECTS; MICROSTRUCTURE; NICKEL; TIN ALLOYS;

INTERFACE REACTION; LEAD-FREE SOLDER; MICROSTRUCTURE EVOLUTION; SN-3.5AG;

SOLDERING ALLOYS;

EID: 4544333934     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

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