Microstructure evolution of the Sn-Ag-y%Cu interconnect

Microelectronics Reliability

Volumn 46, Issue 7, 2006, Pages 1058-1070

  Lu, Henry Y ^a   Balkan, Haluk ^a   Ng, K Y Simon ^b  

^a FlipChip International LLC   (United States)

^b Wayne State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ETCHING; FRACTURE; HEAT TREATMENT; INTERMETALLICS; MICROSCOPIC EXAMINATION; MICROSTRUCTURE;

INTERCONNECT INTERFACIAL MICROSTRUCTURES; ISOTHERMAL AGING; MICROSTRUCTURE EVOLUTION; SURFACE MICROETCHING MICROSCOPY;

SEMICONDUCTING TIN COMPOUNDS;

EID: 33646377653     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2005.08.004     Document Type: Article

References (21)

1. Glazer J. J Electron Mater 23 (1994) 693-700
2. Bradley E., Handwerker C., and Sohn J.E. SMT 1 (2003) 24-26
3. Jang J.W., De Silva A.P., Lee T.Y., Lin J.K., and Frear D.R. Appl Phys Lett 79 (2001) 482-484
4. Alam M.O., Chan Y.C., and Tu K.N. Chem Lett 15 (2003) 4340-4342
5. Stam F.A., and Davitt E. Microelectron Reliab 41 (2001) 1815-1822
6. Henderson D.W., Grosselin T., Sarkhel A., Kang S.K., Choi W.K., Shih D.Y., et al. J Mater Res 17 (2002) 2775-2778
7. Kim K.S., Huh S.H., and Suganuma K. Microelectron Reliab 43 (2003) 259-267
8. Kang S.K., Shih D.Y., Leonard D., Henderson D.W., Gosselin T., Cho S.I., et al. JOM 56 6 (2004) 34-38
9. Ho C.E., Tsai R.Y., Lin Y.L., and Kao C.R. J Electron Mater 31 (2002) 584-590
10. Zhang F., Li M., Balakrisnan B., and Chen W.T. J Electron Mater 31 (2002) 1256-1263
11. Li M., Zhang F., Chen W.T., Zeng K., Tu K.N., Balkan H., et al. J Mater Res 17 (2002) 1612-1621
12. Zeng K., and Tu K.N. Mater Sci Eng Rep R 38 (2002) 55-105
13. Sharif A., and Chan Y.C. J Electron Mater 34 (2005) 46-52
14. Kim K.S., Huh S.H., and Suganuma K. J Alloy Compd 352 (2003) 226-236
15. Ohnuma I., Miyashita M., Liu X.J., Ohtani H., and Ishida K. IEEE Trans Electron Pkg Manuf 26 (2003) 84-89
16. Moon K.W., Boettinger W.J., Kattner U.R., Biancaniello F.S., and Handwerker C.A. J Electron Mater 29 (2000) 1122-1136
17. Moon K.W., and Boettinger W.J. JOM 56 4 (2004) 22-27
18. Allen S.L., Notis M.R., Chromik R.R., Vinci R.P., Lewis D.J., and Schaefer R. J Mater Res 19 (2004) 1425-1431
19. Kim D.H. Proceedings of the 51st electronic components and technology conference, Piscataway, NJ (2001), IEEE 726-732
20. Balkan H., Patterson D., Burgess G., Carlson C., Elenius P., Johnson M., et al. Proceedings of the 52nd electronic components and technology conference, Piscataway, NJ (2002), IEEE 1263-1265
21. Lu H.Y., Balkan H., and Ng K.Y.S. JOM 57 6 (2005) 30-35