Recent achievement in microstructure investigation of Sn0.5Cu3.4Ag lead-free alloy by adding boron

Proceedings - International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

Volumn , Issue , 1999, Pages 262-267

  Ye, L ^a   Lai, Z ^b   Liu, J ^b   Tholen, A ^a  

^a CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^b SWEREA IVF   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

ALLOYING; ALLOYING ELEMENTS; BORON; COPPER ALLOYS; INTERFACES (MATERIALS); LEAD ALLOYS; MICROSTRUCTURE; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; TERNARY ALLOYS; TIN; TIN ALLOYS;

ANALYTICAL METHOD; CREEP AND FATIGUE; CU-AG SYSTEM; LEAD-FREE ALLOY; MICROSTRUCTURAL COARSENING; MICROSTRUCTURE INVESTIGATIONS; SOLDER JOINT RELIABILITY; UNIFORM MICROSTRUCTURE;

PACKAGING MATERIALS;

EID: 84856392200     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.1999.757324     Document Type: Conference Paper

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