Effects of Zn concentration on wettability of Sn-Zn alloy on Cu and on the interfacial microstructure between Sn-Zn alloy and Cu

Acta Metallurgica Sinica (English Letters)

Volumn 19, Issue 4, 2006, Pages 251-257

  Huang, H Z ^a   Wei, X Q ^a   Zhou, L ^a   Liu, X D ^b   Guo, G L ^b  

^a NANCHANG UNIVERSITY   (China)

^b EAST CHINA UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Interface; Intermetallic compound; Lead free solder; Sn Zn alloy; Wettability

Indexed keywords

BINARY ALLOYS; COPPER; DIFFERENTIAL THERMAL ANALYSIS; INTERFACES (MATERIALS); INTERMETALLICS; MICROSTRUCTURE; THERMOANALYSIS; TIN ALLOYS; WETTING; ZINC; ZINC ALLOYS;

INTERFACIAL MICROSTRUCTURE; INTERMETALLIC COMPOUND; LEAD-FREE SOLDER; SN-ZN ALLOY; WETTABILITY; ZN CONCENTRATION;

SOLDERING ALLOYS;

EID: 33750209314     PISSN: 10067191     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1006-7191(06)60052-5     Document Type: Article

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