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Volumn 2005, Issue , 2005, Pages 525-532

Implementing caches in a 3D technology for high performance processors

Author keywords

[No Author keywords available]

Indexed keywords

GLOBAL ROUTING; MICROARCHITECTURE DESIGN; THREE DIMENSIONAL INTEGRATED TECHNOLOGY; WORDLINES;

EID: 33748563957     PISSN: 10636404     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICCD.2005.65     Document Type: Conference Paper
Times cited : (89)

References (26)
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    • February
    • Todd Austin, Eric Larson, and Dan Ernst. SimpleScalar: An Infrastructure for Computer System Modeling. IEEE Micro Magazine, pages 59-67, February 2002.
    • (2002) IEEE Micro Magazine , pp. 59-67
    • Austin, T.1    Larson, E.2    Ernst, D.3
  • 4
    • 0032592096 scopus 로고    scopus 로고
    • Design challenges of technology scaling
    • July
    • Shekhar Borkar. Design Challenges of Technology Scaling. IEEE Micro Magazine, 19(4):23-29, July 1999.
    • (1999) IEEE Micro Magazine , vol.19 , Issue.4 , pp. 23-29
    • Borkar, S.1
  • 7
    • 84942012494 scopus 로고    scopus 로고
    • Three-dimensional integrated circuits: Performance, design methodology, and CAD tools
    • Tampa, FL, USA, February
    • Shamik Das, Anantha Chandrakasan, and Rafael Reif. Three-Dimensional Integrated Circuits: Performance, Design Methodology, and CAD Tools. In Proceedings of the International Symposium on VLSI, pages 13-18, Tampa, FL, USA, February 2003.
    • (2003) Proceedings of the International Symposium on VLSI , pp. 13-18
    • Das, S.1    Chandrakasan, A.2    Reif, R.3
  • 8
    • 2942639675 scopus 로고    scopus 로고
    • Technology, performance, and computer-aided design of three-dimensional integrated circuits
    • Phoenix, AZ, USA, April
    • Shamik Das, Andy Fan, Kuan-Neng Chen, and C. S. Tan. Technology, Performance, and Computer-Aided Design of Three-Dimensional Integrated Circuits. In Proceedings of the International Symposium on Physical Design, pages 108-115, Phoenix, AZ, USA, April 2004.
    • (2004) Proceedings of the International Symposium on Physical Design , pp. 108-115
    • Das, S.1    Fan, A.2    Chen, K.-N.3    Tan, C.S.4
  • 9
    • 2442452519 scopus 로고    scopus 로고
    • 2.5D system integration: A design driven system implementation schema
    • Yokohama, Japan, January
    • Yangdong Deng and Wojciech Maly. 2.5D System Integration: A Design Driven System Implementation Schema. In Proceedings of the Asia South Pacific Design Automation Conference, pages 450-455, Yokohama, Japan, January 2004.
    • (2004) Proceedings of the Asia South Pacific Design Automation Conference , pp. 450-455
    • Deng, Y.1    Maly, W.2
  • 10
  • 11
    • 0347409236 scopus 로고    scopus 로고
    • Efficient thermal placement of standard cells in 3D ICs using a force directed approach
    • San Jose, CA, USA, November
    • Brent Goplen and Sachin Sapatnekar. Efficient Thermal Placement of Standard Cells in 3D ICs Using a Force Directed Approach. In Proceedings of the International Conference on Computer-Aided Design, pages 81-85, San Jose, CA, USA, November 2003.
    • (2003) Proceedings of the International Conference on Computer-aided Design , pp. 81-85
    • Goplen, B.1    Sapatnekar, S.2
  • 19
    • 0034462309 scopus 로고    scopus 로고
    • System level performance evaluation of three-dimensional integrated circuits
    • June
    • Arifur Rahrnan and Rafael Reif. System Level Performance Evaluation of Three-Dimensional Integrated Circuits. IEEE Transactions on VLSI, 8(6):671-678, June 2000.
    • (2000) IEEE Transactions on VLSI , vol.8 , Issue.6 , pp. 671-678
    • Rahrnan, A.1    Reif, R.2
  • 25


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.