PicoServer: Using 3D stacking technology to enable a compact energy efficient chip multiprocessor

International Conference on Architectural Support for Programming Languages and Operating Systems - ASPLOS

Volumn , Issue , 2006, Pages 117-128

  Kgil, Taeho ^a   D'Souza, Shaun ^a   Saidi, Ali ^a   Binkert, Nathan ^a,c   Dreslinski, Ronald ^a   Mudge, Trevor ^a   Reinhardt, Steven ^a,d   Flautner, Krisztian ^b  

^a UNIVERSITY OF MICHIGAN   (United States)

^b ARM LTD   (United Kingdom)

^c HEWLETT PACKARD LABORATORIES   (United States)

^d Reservoir Labs Inc   (Australia)

Author keywords

3D stacking technology; Chip multiprocessor; Full system simulation; Low power; Tier 1 server; Web file streaming server

Indexed keywords

3D STACKING TECHNOLOGY; CHIP MULTIPROCESSOR; FULL-SYSTEM SIMULATION;

CACHE MEMORY; COMPUTER ARCHITECTURE; DYNAMIC RANDOM ACCESS STORAGE; INTERCONNECTION NETWORKS;

THREE DIMENSIONAL COMPUTER GRAPHICS;

EID: 34547476643     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1145/1168857.1168873     Document Type: Conference Paper

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