In situ nanoparticulate-reinforced lead-free Sn-Ag composite prepared by rapid solidification

Journal of Materials Science: Materials in Electronics

Volumn 18, Issue 4, 2007, Pages 463-468

  Shen, J ^a   Liu, Y C ^a   Gao, H X ^a  

^a TIANJIN UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

INTERMETALLICS; MICROHARDNESS; MORPHOLOGY; NUCLEATION; SILVER; SOLDERING ALLOYS; TIN;

HOMOGENEOUSLY-DISTRIBUTED NANOPARTICULATES; SOLIDIFIED SOLDER STRUCTURES;

RAPID SOLIDIFICATION;

EID: 33846109134     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-006-9056-9     Document Type: Article

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