Development of a Novel Adaptive Lead-Free Solder Containing Reinforcements Displaying the Shape-Memory Effect

Journal of Electronic Materials

Volumn 33, Issue 4, 2004, Pages 258-270

  Dutta, I ^a   Majumdar, B S ^b   Pan, D ^a   Horton, W S ^a   Wright, W ^a   Wang, Z X ^b  

^a Naval Postgraduate School ^*  (United States)

^b NEW MEXICO INSTITUTE OF MINING AND TECHNOLOGY   (United States)

Author keywords

Adaptive solder; Composite; Shape memory alloys; Shape memory effect

Indexed keywords

AUSTENITE; COMPOSITE MATERIALS; DEFORMATION; MARTENSITE; MICROELECTRONICS; SHAPE MEMORY EFFECT; SOLDERED JOINTS; STRAIN; THERMAL CYCLING; THERMOMECHANICAL TREATMENT; VOLUME FRACTION;

ADAPTIVE SOLDERS; THERMOMECHANICAL CYCLING (TMC);

SOLDERING ALLOYS;

EID: 2342646126     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-004-0131-9     Document Type: Article

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