Role of anisotropic behaviour of Sn on thermomechanical fatigue and fracture of Sn-based solder joints under thermal excursions

Fatigue and Fracture of Engineering Materials and Structures

Volumn 30, Issue 5, 2007, Pages 420-431

  Subramanian, K N ^a  

^a MICHIGAN STATE UNIVERSITY   (United States)

Author keywords

Anisotropy; Damage; Lead free; Solder; TMF

Indexed keywords

ANISOTROPY; CRACK INITIATION; CRACK PROPAGATION; GRAIN BOUNDARIES; THERMAL EXPANSION; THERMAL FATIGUE; THERMAL STRESS; TIN ALLOYS;

BODY CENTRED TETRAGONAL; THERMAL EXCURSIONS; THERMOMECHANICAL FATIGUE;

SOLDERED JOINTS;

EID: 34247562843     PISSN: 8756758X     EISSN: 14602695     Source Type: Journal    
DOI: 10.1111/j.1460-2695.2006.01070.x     Document Type: Article

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