Thermal fatigue endurance of collapsible 95.5Sn4Ag0.5Cu spheres in LTCC/PWB assemblies

Microelectronics Reliability

Volumn 48, Issue 4, 2008, Pages 622-630

  Nousiainen, O ^a   Lehtiniemi, L ^a   Kangasvieri, T ^a   Rautioaho, R ^a   Vahakangas J ^a  

^a UNIVERSITY OF OULU   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

SOLDERED JOINTS; SPHERES; THERMAL CYCLING; THERMAL EFFECTS;

GLOBAL THERMAL MISMATCH; TEMPERATURE RANGE;

THERMAL FATIGUE;

EID: 42649124931     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2007.11.001     Document Type: Article

References (19)

1. Nousiainen O., Putaala J., Kangasvieri T., Rautioaho R., and Vähäkangas J. Metallurgical reactions in composite 90Pb10Sn/lead-free solder joints and their effect on reliability of LTCC/PWB assembly. J Electron Mater 35 10 (2006) 1857-1865
2. Farooq M., Goldsmith C., Jackson R., and Martin G. Lead-free ceramic ball grid array: thermomechanical fatigue reliability. J Electron Mater 32 12 (2003) 1421-1425
3. Qi Y., Lam R., Ghorbani H.R., Snugovsky P., and Spelt J.K. Temperature profile effects in accelerated thermal cycling of SnPb and Pb-free solder joints. Microelectron Reliab 46 2-4 (2006) 574-588
4. Syed A, Doty M. Are we over designing for solder joint reliability? Field vs. accelerated conditions, realistic vs. specified requirements. In: Proceedings of the 1999 electronic components and technology conference, San Diego, CA, USA; 1999. p. 111-7.
5. Lehtiniemi L, Nousiainen O, Kangasvieri T, Vähäkangas J. Reliability of lead-free single-melt solder joints in LTCC/PWB assemblies. In: Proceedings of new exploratory technologies 2006 conference (NEXT), Salo, Finland; 2006. p. 63-7.
6. JEDEC Standard No. 22-A104C, JEDEC; 2005.
7. Semmens JE, Kessler LW. Characterization of flip chip interconnect failure modes using high frequency acoustic micro imaging with correlative analysis. In: Proceedings of fifth annual IEEE international reliability physics symposiums, New York, NY, USA; 1997. p. 141-8.
8. Nousiainen O, Rautioaho R, Leppävuori S, Uusimäki A, Tian D. Acoustic micro imaging of fatigue cracking in solder joints of LTCC modules. In: Proceedings of the 13th European microelectronics and packaging conference, Strasbourg, Belgium; 2001. p. 172-7.
9. Prabhu A, Schafer WJ, Patil S. High reliability LTCC BGA for telecom applications. In: Proceedings of the 26th IEEE/CPTM international electronics manufacturing technology symposium, Santa Clara, CA, USA; 2001. p. 311-23.
10. Nousiainen O., Rautioaho R., Kautio K., Jääskeläinen J., and Leppävuori S. Solder joint reliability in AgPt-metallized LTCC modules. Solder Surf Mount Technol 17 3 (2005) 32-42
11. Jones WK, Yanquin L, Larsen B, Peng W, Zampino M. Chemical, structural and mechanical properties of the LTCC tapes. In: Proceedings of 2000 international symposium on microelectronics, Boston, MA, USA; 2000. p. 669-74.
12. Kangasvieri T., Nousiainen O., Putaala J., Rautioaho R., and Vähäkangas J. Reliability and RF performance of BGA solder joints with plastic-core solder balls in LTCC/PWB assemblies. Microelectron Reliab 46 8 (2006) 1335-1347
13. Nousiainen O., Putaala J., Kangasvieri T., Rautioaho R., and Vähäkangas J. Failure mechanisms of thermomechanically loaded SnAgCu/PCSB composite joints in LTCC/PWB assemblies. J Electron Mater 36 3 (2007) 232-241
14. Freescale Semiconductor. Application note: manufacturing with the land grid array package, Doc. no. AN2920; 2005. 13 p.
15. Hwang J.S. Environment-friendly electronics: lead-free technology. 1st ed. (2001), Electrochemical Publications, Port Erin
16. Terashima S., Takahama K., Nozaki M., and Tanaka M. Recrystallization of Sn grains due to thermal strain in Sn-1.2Ag-0.5Cu-0.05Ni solder. Mater Trans 45 4 (2004) 383-390
17. Hendersson D.W., Woods J.J., Gosselin T.A., Bartelo J., King D.E., Korhonen T.M., et al. The microstructure of Sn in near-eutectic Sn-Ag-Cu alloy solder joints and its role in thermomechanical fatigue. J Mater Res 19 6 (2004) 1608-1612
18. Mattila T.T., Vuorinen V., and Kivilahti J.K. Impact of printed wiring board coatings on the reliability of lead-free chip-scale package interconnections. J Mater Res 19 11 (2004) 3214-3223
19. Terashima S., Kariya Y., Hosoi T., and Tanaka M. Effect of silver content on thermal fatigue life of Sn-xAg-0.5Cu flip-chip interconnects. J Electron Mater 32 12 (2003) 1527-1533