PicoServer: Using 3D stacking technology to build energy efficient servers

ACM Journal on Emerging Technologies in Computing Systems

Volumn 4, Issue 4, 2008, Pages

  Kgil, Taeho ^a   Saidi, Ali ^a   Binkert, Nathan ^b   Reinhardt, Steve ^a   Flautner, Krisztian ^c   Mudge, Trevor ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

^b HEWLETT PACKARD LABORATORIES   (United States)

^c ARM LTD   (United Kingdom)

Author keywords

3D stacking technology; Chip multiprocessor; Full system simulation; Low power; Tier 1 2 3 server

Indexed keywords

DIES; DYNAMIC RANDOM ACCESS STORAGE; ENERGY EFFICIENCY; MICROPROCESSOR CHIPS; POWDERS; SERVERS; TECHNOLOGY; WIRELESS TELECOMMUNICATION SYSTEMS;

3D STACKING TECHNOLOGY; CHIP MULTIPROCESSOR; FULL-SYSTEM SIMULATION; LOW POWER; TIER-1/2/3 SERVER;

DATA STORAGE EQUIPMENT;

EID: 56349152231     PISSN: 15504832     EISSN: 15504840     Source Type: Journal    
DOI: 10.1145/1412587.1412589     Document Type: Article

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